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| Price : | ₹ 1200.00 + 70.00 Shipping and Handling |
| Condition : | New Packed |
| Alloy Composition : | Sn 63 Pb37 |
| Ball Diameter : | 0.35 mm |
| Tolerances : | +/- 0.015 mm |
| CPK : | ≥ 1.33 |
| Brand : | Q-Win |
| Quantity : | 250,000 Pc |
| Part No. : | QW-SP63-Q350 |
| Lot No. : | Y259-QWSP-16040601765A-7 |
| Company Profile : | Qun Win Electronic Materials Co. Ltd. is a Taiwan-owned enterprise. |
BGA Solder Balls 0.35mm Leaded Sn63 Pb37. BGA Solder Balls 0.35mmPrice : ₹ 1200.00 + 70.00 Shipping and HandlingCondition : New PackedAlloy Composition : Sn 63 Pb37Ball Diameter : 0.35 mmTolerances : +/- 0.015 mmCPK : ≥ 1.33Brand : Q-WinQuantity : 250,000 PcPart No. : QW-SP63-Q350Lot No. : Y259-QWSP-16040601765A-7Company Profile : Qun Win Electronic Materials Co. Ltd. is a Taiwan-owned enterprise.
| Item Condition | New |
|---|---|
| Brand | QWin |
| Item Location | Delhi |
| Warranty | No Warranty |
| Weight Kg | 0.5000 |
| Country of Manufacture | China |
| Shipping | Same Day if ordered before 6:00 PM |
| Compatible Part No. | QW-SP63-Q350 |
